MCAD CoDesigner Update: Enhanced Rigid-Flex and Multi-board Assembly Support

Rigid-Flex Design Transfer to Siemens NX (Advanced)

Feature: MCAD CoDesigner now supports the transfer of Advanced Rigid-Flex (RF2) designs from Altium Designer to Siemens NX. 

• Support for any number of rigid and flexible regions.
• Accurate representation of varying flex region thicknesses.
• Transfer of overlapping flexible regions.
• Visualization of copper and silkscreen layers on rigid regions within Siemens NX.
• Representation of localized bends within flex region cutouts.

Benefit: This enhancement facilitates more accurate representation of complex flexible circuit designs in Siemens NX, reducing the need for manual adjustments and improving collaboration on electromechanical assemblies involving flexible PCBs.

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Multi-board Assembly Synchronization with Autodesk Inventor

Feature: MCAD CoDesigner now enables the synchronization of multi-board assemblies between Altium Designer and Autodesk Inventor. This allows for the transfer of the assembled PCB structure, including board placement and orientation.

Benefit: This feature allows both electrical and mechanical engineers to visualize the complete device assembly in their respective design environments. ECAD engineers can perform electro-mechanical checks (e.g., component clearances), and mechanical engineers can ensure accurate integration of the PCBs within the enclosure. This improves communication and reduces potential integration issues.

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